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t-1 (3 mm) auto insertable led lamps technical data hlmp-n305 hlmp-n405 hlmp-ng0x hlmp-nl06 features ? t-1 (3 mm) auto insertable package ? alingap sunpower intensity ? high light output ? tinted diffused and tinted non-diffused lens options ? wide viewing angle ? variety of colors ? available with straight or formed lead tape and reel options description this family of 3 mm led lamps is capable of withstanding automatic insertion and wave soldering processes. designed with a thick epoxy flange and soft leadframe material, it is ideal for clinch and cut operations. applications ? general purpose ? high volume manufacturing note: 1. 2 q 1 / 2 is the off axis angle where the luminous intensity is 1 / 2 the on axis intensity. device selection guides high brightness lamps package luminous intensity, viewing angle, color part number tinted diffused min. iv @ 20 ma 2 q 1 / 2 red HLMP-NG05 m 90.2 45 hlmp-ng07 m 90.2 60 amber hlmp-nl06 m 96.2 60 high efficiency lamps package luminous intensity, viewing angle, color part number tinted diffused min. iv @ 10 ma 2 q 1 / 2 gap yellow hlmp-n305 x 14.7 45 gap orange hlmp-n405 x 13.8 45
2 package dimensions 2.0 (0.08) ref. 0.4 ?0.2 (0.01 ?0.01) 2.5 ?0.3 (0.10 ?0.01) 0.45 ?0.10 (0.02 ?0.007) 0.4 ?0.2 (0.02 ?0.01) 0.4 + 0.1 0 (0.2 + 0.00 - 0.00 ) 3.4 ?0.2 (0.13 ?0.01) cathode marks 0.65 (0.03) max. 3.1 ?0.2 (0.12 ?0.01) 4.4 ?0.3 (0.17 ?0.01) 3.5 ?0.3 (0.14 ?0.01) 5.9 ?0.5 (0.23 ?0.02) 23.0 (0.91) 1.0 ?0.5 (0.04 ?0.02) seating plane notes: 1. all dimensions are in millimeters (inches). 2. leads are mild steel. solder coated. 3. epoxy meniscus of 0.8 mm (0.03 in.) maximum may extend to the leads. part numbering system hlmp - n x xx # xxx mechanical option 002: tape & reel, straight leads viewing angle options 01: 45 degree 05: 45 degree 06, 07: 60 degree color options 3: gap yellow 4: gap orange g: alingap red l: alingap amber
3 absolute maximum ratings at t a = 25 oc parameter orange yellow amber & red units dc forward current [1] 30 20 30 [2,3] ma reverse voltage 5 v (ir = 100 m a) junction temperature, 110 c t jmax storage temperature -40 to +85 c range operating temperature -20 to +85 -40 to +85 c range lead soldering a) dip/drag soldering: 260 c for 5 seconds temperature b) wave solder temperature: 245 c for 3 seconds [1.6 mm (0.063 in.) from seating plane] notes: 1. see figure 4 for maximum current derating vs. ambient temperature. 2. suggested minimum dc current: 10 ma 3. maximum peak pulsed forward current: 50 ma, 30 ma average. a1ingap
4 notes: 1. the luminous intensity, lv, is measured at the mechanical axis of the lamp package. the actual peak of the spatial radiation pattern may not be aligned with this axis. 2. the dominant wavelength, l d, is derived from the cie chromaticity diagram and represents the color of the device. 3. the radiant intensity, le, in watts per steradian, may be found from the equation le = lv/ h v , where lv is the luminous intensity in candelas and h v is the luminous efficacy in lumens/watt. electrical characteristics at t a = 25 oc capacitance speed of response forward c (pf) t s (ns) voltage vf = 0, thermal time constant vf (volts) f = 1 mhz resistance r q j-pin e -t / t s part number typ. max. if (ma) typ. ( c/w) typ. hlmp-n30x 2.00 2.6 10 15 290 90 hlmp-n40x 1.90 2.6 10 4 290 280 hlmp-nlo6 [1] 2.02 2.4 20 40 240 20 hlmp-ng0x [1] 1.90 2.4 20 40 240 20 note: 1. please contact your agilent sales representative about operating currents below 10 ma. optical characteristics at t a = 25 oc luminous typ. dominant efficacy luminous intensity typ. peak wavelength typ. spectral width part number min. if (ma) wavelength (nm) (nm) half width (lm/w) HLMP-NG05 90.2 20 635 626 17 150 hlmp-ng07 90.2 20 635 626 17 150 hlmp-nl06 96.2 20 592 590 17 480 hlmp-n305 14.7 10 583 585 36 500 hlmp-n405 13.8 10 600 602 37 380
5 figure 1. relative intensity vs. peak wavelength. figure 2. forward current vs. forward voltage. 0 70 60 40 20 i f ?forward current ?ma v f ?forward voltage ?v 1.0 3.0 amber high brightness lamps dh asalgaas red 1.5 2.0 2.5 10 30 50 alingap red red-orange alingap red wavelength ?nm relative intensity 1.0 0.5 0 550 600 650 700 amber high brightness lamps dh algaas red orange wavelength ?nm relative intensity 1.0 0.5 0 500 550 600 650 700 yellow high efficiency lamps 0 90 70 60 40 20 i f ?forward current ?ma 1.5 3.5 2.5 0.5 v f ?forward voltage ?v 0 4.0 yellow high efficiency lamps orange 1.0 2.0 3.0 10 30 50 80
6 relative luminous intensity (normalized at 20 ma) 0 0 i f ?dc forward current ?ma 10 20 1.0 0.5 30 1.5 high brightness lamps 40 alingap dh as algaas 2.0 figure 4. maximum forward dc current vs. ambient temperature. figure 3. relative luminous intensity vs. forward current. i f ?forward current ?ma 0 0 t a ?ambient temperature ?? 40 80 40 20 10 20 60 30 5 15 25 35 alingap r q ja = 500?c/w r q ja = 650?c/w r q ja = 750?c/w 10 30 50 70 90 relative luminous intensity (normalized at 10 ma) 0 0 i dc ?dc current per led ?ma 10 20 4.0 2.0 1.0 515 30 3.0 25 0.5 1.5 2.5 3.5 orange,and yellow i f ?forward current ?ma 0 0 t a ?ambient temperature ?? 40 80 40 20 10 60 30 5 15 25 35 orange and yellow r q ja = 470?c/w r q ja = 705?c/w r q ja = 300?c/w yellow orange 20
7 normalized intensity 1 0 angular displacement ?degrees 0.8 0.6 0.5 0.7 0.2 -90 0.1 0.3 0.4 -80 -70 -60 -50 -40 -20 -10 0 -30 10 20 30 40 50 60 70 80 90 0.9 figure 5. representative spatial radiation pattern for 45 viewing angle. normalized intensity 1 0 angular displacement ?degrees 0.8 0.6 0.5 0.7 0.2 -90 0.1 0.3 0.4 -80 -70 -60 -50 -40 -20 -10 0 -30 10 20 30 40 50 60 70 80 90 0.9 figure 6. representative spatial radiation pattern for 60 viewing angle.
8 intensity bin limits intensity range (mcd) color bin min. max. h 13.8 27.6 i 22.0 44.0 j 35.2 70.4 k 56.4 112.8 l 90.2 180.4 m 138.0 276.0 n 200.0 400.0 o 290.0 580.0 red/orange p 500.0 1000.0 q 700.0 1400.0 r 1000.0 2000.0 s 1400.0 2800.0 t 2000.0 4000.0 u 2900.0 5800.0 v 4200.0 8400.0 w 6000.0 12000.0 x 8700.0 17400.0 y 12600.0 25200.0 z 18200.0 36400.0 g 14.7 29.4 h 23.5 47.0 i 37.6 75.2 j 60.1 120.2 k 96.2 192.4 l 147.0 294.0 m 212.0 424.0 yellow n 300.0 600.0 o 450.0 900.0 p 700.0 1400.0 q 1000.0 2000.0 r 1600.0 3200.0 s 2600.0 5200.0 t 4000.0 8000.0 u 6500.0 13000.0 v 10000.0 20000.0 w 16000.0 30000.0 maximum tolerance for each bin limit is 18%.
9 color categories lambda (nm) color category # min. max. 1 582.0 584.5 3 584.5 587.0 yellow 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 orange 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 taping options straight lead option #002 #2ca #2cd dimension b C C C dimension h 20.5 1.0 18.0 1.0 20.5 1.0 (0.81 0.04) (0.71 0.04) (0.81 0.04) formed lead option #2uk #2ul #2um #2un #2up #2uq #2ur dimension b 12.0 1.0 9.0 1.0 10.0 1.0 11.0 1.0 13.0 1.0 14.0 1.0 15.0 1.0 (0.47 0.04) (0.35 0.04) (0.39 0.04) (0.43 0.04) (0.51 0.04) (0.55 0.04) (0.59 0.04) dimension h 16.0 1.0 (0.63 0.04) units: mm (inches) tolerance for each bin limit is 0.5 nm.
10 straight lead formed lead 1.5 (0.06) max. 2.5 (0.10) max. 14.0 ?1.7 (0.55 ?0.07) 18.0 ?1.0 (0.71 ?0.04) 6.4 ?1.3 (0.25 ?0.05) 12.7 ?1.0 (0.50 ?0.04) 9.1 ?0.6 (0.36 ?0.03) 0.0 ?1.0 (0.00 ?0.04) 0.0 ?1.0 (0.00 ?0.04) 11.0 (0.43) max. dimension "h" (see table) 5.1 ?0.7 (0.20 ?0.03) 12.7 ?0.3 (0.50 ?0.01) 2.5 ?0.3 (0.10 ?0.01) cathode lead 0.7 ?0.2 (0.03 ?0.01) aa view a? ? 4.0 ?0.2 (0.16 ?0.01) typ. 1.5 (0.06) max. 2.5 (0.10) max. 14.0 ?1.7 (0.55 ?0.07) 18.0 ?1.0 (0.71 ?0.04) 6.4 ?1.3 (0.25 ?0.05) 12.7 ?1.0 (0.50 ?0.04) 9.1 ?0.6 (0.36 ?0.03) 0.0 ?1.0 (0.00 ?0.04) 0.0 ?1.0 (0.00 ?0.04) 11.0 (0.43) max. dimension "h" (see table) 3.9 ?0.7 (0.15 ?0.03) 12.7 ?0.3 (0.50 ?0.01) 2.5 ?0.3 (0.10 ?0.01) cathode lead 0.7 ?0.2 (0.03 ?0.01) aa view a? ? 4.0 ?0.2 (0.16 ?0.01) typ. dimension "b" (see table) tape outline drawing
11 recommended assembly condition ? a single-sided phenolic printed circuit board (pcb) is preferred. double-sided pcb and other materials may cause greater lead stress. recommended through-hole diameter is 0.93 to 1.03 mm. leadlength below the pcb should be 1.5 to 2.0 mm, and the clinching angle (angle between the lead and pcb) should be 30 10 degrees. ? if smt devices and an adhesive are used on the same pcb as these lamps, the adhesive should be cured before the lamps are auto-inserted. if curing must be done after lamp insertion, the cure temperature and time should not exceed 140 c, 100 seconds. this is the temperature of the surface normal to the ir source. solder condition: preheat: temperature ramp rate of 2 to 4 c per second. do not exceed 150 c delta temperature between preheat and solder temperatures. the maximum time at preheat should not exceed 10 seconds. solder: 245 c 5 c, 3 seconds (1.6 mm below seating plane). tape & reel (for option #002 only) ammo pack (for all options except #002) package options lead option ammo pack (1000 pcs.) tape & reel (2000 pcs.) straight lead #2c #002 formed lead #2u C from left side of box, adhesive tape is facing upward. made in malaysia anode leds operator ......... hp part # ........... date code ........ taping date ..... bin ....................... no. of gaps ..... quantity .......... cathode c a + anode lead leaves the box first. 336 (13.23) 52 (2.05) 140 (5.51) dimensions in millimeters (inches). reeling orientation clockwise adhesive tape must be facing towards the outside of the reel. anode lead leaves the reel first. protective cardboard 110 (4.33) dia. 336 (13.23) dia. dimensions in millimeters (inches).
www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 6756 2394 india, australia, new zealand: (+65) 6755 1939 japan: (+81 3) 3335-8152(domestic/interna- tional), or 0120-61-1280(domestic only) korea: (+65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (+65) 6755 2044 taiwan: (+65) 6755 1843 data subject to change. copyright ? 2003 agilent technologies, inc. obsoletes 5988-4549en june 6, 2003 5988-9725en

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